The following are some of the stacking methods used to increase density per module:
TSOP DRAM Stacking
Source: STEC
Module Stacking
Source: Kingston Memory (modified for clarity)
Proprietary BGA Stacking
Source: Tessera
TSOP Tape Carrier Package stacking technique Chip is placed on a tape with its reverse face exposed.
Source: Elpida Memory
An interesting technique called “Folded Printed Circuit Board” is used by SMART Modular Technologies with its CoolFlex DDR2 2GB low profile module. It uses a folded PCB technology to double the memory capacity and eliminate the need for stacked or multi-die DRAMs. It is a relatively cost effective method when compared to more complex multi-die stacking technique.
Very Low Profile 2GB DDR2 with Folded Printed Circuit Board
Source: SMART Modular Technologies
TSOP DRAM Stacking
Source: STEC
Module Stacking
Source: Kingston Memory (modified for clarity)
Proprietary BGA Stacking
Source: Tessera
TSOP Tape Carrier Package stacking technique Chip is placed on a tape with its reverse face exposed.
Source: Elpida Memory
An interesting technique called “Folded Printed Circuit Board” is used by SMART Modular Technologies with its CoolFlex DDR2 2GB low profile module. It uses a folded PCB technology to double the memory capacity and eliminate the need for stacked or multi-die DRAMs. It is a relatively cost effective method when compared to more complex multi-die stacking technique.
Very Low Profile 2GB DDR2 with Folded Printed Circuit Board
Source: SMART Modular Technologies
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